Mask Aligners:
 
A highly versatile high-resolution contact/proximity manual mask aligner and UV exposure system suitable for R&D, Pilot Production, and Manufacturing applications featuring a wide range of optional interchangeable and upgradeable modular sub-systems which include a choice of UV lightsources, UV operating spectrums, power supplies, mask and wafer/substrate holders, and viewing/alignment optics. Unexcelled in its long term reliability, versatility, and ease of use, the ABM Mask Aligner and Exposure System is a powerful photolithography tool that combines functionality and low cost of ownership.
   
Specifications  
  • Table-top mask aligner system
  • Precision alignment module for single-die/piece-parts up to 6” wafers/substrates. Option for up to 8” wafers/substrates
  • Interchangeable fixed-level or planarizing (wedge compensation) vacuum chucks with pre-alignment pins
  • Continuously adjustable hard/soft, vacuum contact and proximity printing
  • Micrometer driven 0.5 μm X, Y, and 0.0001 degree Theta chuck motion. Option for differential micrometers
  • Chuck Travel X/Y ±6 mm, Theta ±5°
  • Precision Z adjust chuck motion with pressure adjustable mechanical clutch (for setting substrate-to-mask pressure) with auto-planarization (for leveling of wafer to mask)
  • Interchangeable top or bottom-load 2” to maximum 7” size vacuum mask holders. Option for up to 9” size vacuum mask holder
  • Coarse mask rotation motion up to +/-45 degrees
  • Nitrogen purge between mask and substrate/wafer
  • 6” round/square uniform collimated NUV (365-436 nm) exposure beam. Option for DUV (220-280 nm) and MUV (280-310 nm) wavelengths and for 8” round/square uniform collimated exposure beam
  • Precision heat removing quartz dielectric coated mirrors
  • Calibrated speed exhaust fan with thermocouple for over-temperature protection
  • Fly’s eye diffraction reducing antireflection (AR) coated optics
  • Full-field collimating lens with beam divergence half angle <1.85 degrees
  • Integrated dual wavelength intensity sensors and feedback circuits
  • Hg Arc lamp with UV leak proof enclosure
  • Temperature and air-flow sensors with safety cut-off
  • Arrangement for insertion and mounting of wavelength and neutral density filters
  • Manual/auto expose digital adjustable shutter timer from 0.1 to 999.9 seconds
  • Adjustable wattage 2-Channel 350 Watt NUV Constant Intensity/Constant Power controlling power supplies. Option for 500 Watt, 1000 Watt, and 2,000 Watt DUV and NUV power supplies
  • Audible Alarm for over-power and lamp protection
  • Single/Split-field Dual CCD Camera alignment systems with 90x – 600x video zoom magnification. Option for high 180x – 1200x magnification and for Single/Split-field Microscope alignment system
  • Microscope Memory Pre-alignment Function (for return of microscope to last set alignment position)
  • Microscope mounting with pneumatic locking for X, Y motion and coarse/fine Z focus
  • Electronic/pneumatic operator control panel and system. Option for semi-auto PLC with touch panel operation/control
  • Fully safety interlocked and Emergency Shut-off system
  • System Upgrade and Optional Items:
    • Precision alignment module for up to maximum 8” wafers/substrates
    • 8” round/square uniform collimated UV exposure beams for DUV (220-280 nm), MUV (280-310 nm), and NUV (365-450 nm) wavelengths
    • Semi-auto PLC with touch panel operation/control
    • Differential micrometers for fine 0.1 μm X, Y, and 0.00001 degree Theta chuck motion
    • Joystick for motorized X, Y, Theta chuck motion
    • Ring illumination (for BF/DF illumination)
    • Prism blocks (for reducing minimum Split-field Dual CCD Camera separation) down to 10 mm
    • High magnification up to 2000x
    • Motorized zoom and focus (for zoom tubes with CCD Camera alignment systems)
    • Backside Infrared (BSIR) alignment system
    • Backside Visible (BSV) alignment system
    • Large Gap Function (LGF) alignment system
    • UV Nanoimprint Lithography (UV-NIL) module
    • Wafer Clamping System for alignment and clamping of wafers for transfer to Wafer Bonder for final bonding
    • G-, H-, I-Line wavelength filters
    • Neutral Density (ND) filters
    • Intensity meter with single/dual wavelength probes
    • Standard support and vibration isolation tables
    • Oil-free vacuum pumps and compressors
    • Remote exhaust fan
    • UV-400 protection goggles
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