• R&D, Rapid Prototyping, Pilot Production, and Full-scale Production
• Semiconductor Devices
• Microelectronic Devices
• Optoelectronic Devices (LED, laser-diodes, waveguide arrays)
• Detectors (CCD, near- and far-IR, real-time X-ray)
• Displays (LCD, Polymer LCD, Organic LED)
• Electronic Packaging (bumping and wafer-level CSP)
• SAW Devices
• MEMS and MOEMS
• Nanoimprinting Lithography (NIL)
• Biomedical and Photolysis processes
• High-resolution Contact and Proximity Printing
• Photoimageable layers including negative, positive, image reversal, g-, h-, i-line and DUV photoresists, Dry-film, BCB, Polyimide, SU-8, PMMA,…..
• Substrates including Si, GaAs, GaN, SiGe, InP, InSb, SOI, SOS, CZT, MCT, LiNbO3, Quartz, Sapphire, Glass, FR-4/5, BT-epoxy, Kapton, Metal,…….